发明名称 WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a wiring board being capable of adjusting the impedance of a signal line at a specified value and being easily thinned. SOLUTION: In the wiring board 9, the signal lines 2 are arranged in an insulating board 1 while pairs of ground conductor layers 3 are arranged on both upper-lower sides of the signal lines 2. In the wiring board 9, pairs of auxiliary ground-conductor layers 4 are disposed oppositely so as to hold at least parts of the signal lines 2 between the signal lines 2 and each ground conductor layer 3. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006210676(A) 申请公布日期 2006.08.10
申请号 JP20050021188 申请日期 2005.01.28
申请人 KYOCERA CORP 发明人 YAGIMURA KENJI
分类号 H05K1/02;H05K3/46 主分类号 H05K1/02
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