| 摘要 |
PROBLEM TO BE SOLVED: To provide a high frequency module capable of realizing high isolation and a low loss by specifying a positional relation between the terminal arrangement of a high frequency switch and the terminal arrangement of the high frequency module. SOLUTION: A high frequency switch circuit element 24 is mounted on an upper side of a dielectric multilayer board 20, the high frequency switch circuit element 24 is provided at its bottom side a plurality of reception signal terminals connected to a reception circuit, the upper side of the dielectric multilayer board 20 is provided with electrode pads 22 connected to both of received signal terminals of the high frequency switch circuit element 24 and a plurality of external connection terminals 35, and connection wires such as connection conductor wires 26, 26' formed on the upper side and the inside of the dielectric multilayer board 20 for connecting the electrode pads 22 of the dielectric multilayer board 20 to the external connection terminals are not crossed with each other in a virtual transparent view through the dielectric multilayer board 20 in the lamination direction. COPYRIGHT: (C)2006,JPO&NCIPI
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