| 摘要 |
PROBLEM TO BE SOLVED: To provide a package structure manufacturing method which is capable of restraining a plating layer formed on a circuit pattern and a sealing pattern from varying in thickness, and controlling the thickness of the plating layer easily. SOLUTION: The package structure manufacturing method comprises a first process of forming circuit pattern 12a and 22a and sealing patterns 12b and 22b on the main surfaces of a first board 21 and a second board 11, a second process of mounting a semiconductor chip 23 on the first circuit board 21 through the intermediary of a circuit pattern 22a, a third process of forming a plating layer 13 on the circuit pattern 12a and the sealing pattern 12b formed on the second board 11, and a fourth process of bonding the circuit patterns 12a and 22a together and the sealing patterns 12b and 22b together through the intermediary of the plating layer 13 respectively. In the third process of forming the plating layer 13, the width of the plating layer 13 formed on the circuit pattern 12a and that of the plating layer 13 formed on the sealing pattern 21b are previously set so as to make the plating layers 13 formed on the circuit pattern 12a and the sealing pattern 12b respectively nearly equal in thickness to each other. COPYRIGHT: (C)2006,JPO&NCIPI
|
