发明名称 ELECTRONIC PART HOUSING VESSEL AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an electronic part housing vessel capable of keeping an electronic part working normally for a long term without causing its characteristics to deteriorate, and being superior in hermetic sealing reliability. SOLUTION: The electronic component, housing vessel is constituted of an insulating board 1, equipped with wiring conductors 6 formed on its top surface to connect the electronic part electrically, and a lid 2 whose undersurface has a recess for housing an electronic component 4 and is bonded to the top surface of the insulating board 1 through the intermediary of a sealing material 3. The sealing material 3 is of thickness 30 to 50μm and is formed of glass that contains ceramic filler which is 20 to 30μm in maximum grain diameter and 3 to 4μm in average grain diameter. The sealing material 3 is configured in fillets through a method, wherein inner sides of the sealing material 3 are made to spread inward as they approach the board 1, and the outer sides are made to spread outwardly, as they approach the insulating board 1. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006210628(A) 申请公布日期 2006.08.10
申请号 JP20050020433 申请日期 2005.01.27
申请人 KYOCERA CORP 发明人 ITO YOSHIAKI
分类号 H01L23/10 主分类号 H01L23/10
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