发明名称 CAPACITOR MATERIAL USED IN CIRCUIT BOARD, CIRCUIT BOARD UTILIZING SAID CAPACITOR MATERIAL, METHOD OF MANUFACTURING CIRCUIT BOARD, AND INFORMATION PROCESSING SYSTEM UTILIZING CIRCUIT BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a new material which can be used as a part of a capacitor provided within a circuit board. <P>SOLUTION: A material used as a part of a capacitor provided within a circuit board includes a polymer resin (such as a cycloaliphatic epoxy resin or a phenoxy based resin) and a specified quantity of nanopowders made of a ferroelectric ceramic material (such as barium titanate). The nanopowders made of a ferroelectric ceramic material (such as barium titanate) have a particle size in the range of approximately 0.01 &mu;m to approximately 0.90 &mu;m, and selected particles among the particles have a surface area in the range of approximately 2.0 to approximately 20 square meters per gram. A capacitor using the material, a circuit board 27, an electrical assembly, and an information processing system (such as a personal computer) are also provided. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006210911(A) 申请公布日期 2006.08.10
申请号 JP20060001082 申请日期 2006.01.06
申请人 ENDICOTT INTERCONNECT TECHNOLOGIES INC 发明人 DAS RABINDRA N;LAUFFER JOHN M;PAPATHOMAS KOSTAS I;MARK D POLIKS
分类号 H01G4/12;H01B3/00;H01G4/20;H01L23/12;H05K1/03;H05K1/16;H05K3/46 主分类号 H01G4/12
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