| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a terminal mounting structure capable of reliable solder mounting even for a component terminal having large thermal capacity. <P>SOLUTION: The component terminal 1 comprises a leg section 2 as a body section, and an insertion section 3 that becomes the end section of the component terminal 1. Since a slit-like thin cutout 7 crossing the an insertion section 3 entirely lengthwise is formed at the center of the insertion section 3, the insertion section 3 is divided into two terminal pieces 5, 5, and a hole 8 communicating with the cutout 7 is formed at the base section. Wide sections 6, 6 that project outside and become wide are formed at the tip of the terminal pieces 5, 5. Solder 15 is melted by the heating of for example a soldering iron and becomes the liquid melted solder 15, and solderability advances up to an area near the cutout 7 in the insertion section 3, thus sucking the melted solder 15 in the cutout 7 by capillary action. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
