METHOD OF HEATING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To raise the temperature of a substrate at high speed, while the temperature of a substrate is maintaining uniformly. SOLUTION: The substrate 14 is forced on a heater cover 15 in which the substrate 14 is placed by a pusher 19 so that a clearance makes it hard to be able to form between the heater cover 15 and the substrate 14. A low cost H2with high thermal conductivity is introduced into a deposition chamber, and a temperature rises. The density of the H2is reduced once at the timing when the substrate 14 starts floating from the heater cover 15 by the warpage of the substrate 14. When the temperature of the substrate 14 becomes uniform, it is again elevated in the density of the H2. The molecule density of the H2is controlled to become 1×1023pieces/m3to 3×1023pieces/m3(1,000 Pa), and preferably near 2×1023pieces/m3. COPYRIGHT: (C)2006,JPO&NCIPI