发明名称 |
Backside coating for MEMS wafer |
摘要 |
A transparent substrate has a micro electromechanical system (MEMS) on a first side of the substrate. An opaque layer is formed on a second side of the transparent substrate opposite the first side. The opaque layer comprises a first material that is removable by a MEMS release process. A second layer is formed on the opaque layer. The second layer comprises a second material that prevents contamination of a front end of line machine by the first material during a front end of line fabrication process.
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申请公布号 |
US2006177992(A1) |
申请公布日期 |
2006.08.10 |
申请号 |
US20050056142 |
申请日期 |
2005.02.10 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
CHEN FEI-YUH;CHU EUGENE;CHANG YUH-HWA;HO DAVID |
分类号 |
H01L21/00;H01L21/30 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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