| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic equipment to which components are mounted without fail, regardless of the package size of the components, when mounting of the component to the substrate of the electronic equipment. SOLUTION: The substrate 50 to which the components 51 and 52 are mounted is covered with a shielding plate 60, and they are housed inside a casing lower part 70 and a casing upper part 80 to constitute the electronic equipment 5. In the part located directly above the component 51 of the shield plate 60, a group of protrusions 61 is provided to the surface on the side facing the substrate 50, and the tip of each protrusion is brought into contact with the top surface of the package of the component 51. Further in the part located directly above the component 52 of the shielding plate 60, a group of protrusions 62 is provided to the surface on the side facing the substrate 50, and the tip of each protrusion is brought into contact with the top surface of the package of the component 52. A force in the direction, in which the component 51 or the component 52 is pressurized against the substrate 50, is made to act almost equally on the entire top surface of each package, by arranging each protrusion through distributing. COPYRIGHT: (C)2006,JPO&NCIPI
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