| 摘要 |
A piezoelectric element plate is rectangular as seen from above. Its upper surface is formed to be flat, while it lower surface has a beveling arc applied thereto. The piezoelectric plate is mounted on a package by adsorbing one longitudinal end of its upper surface (flat surface) by an adsorbing nozzle. Then, ultrasonic waves are applied through the adsorbing nozzle to a bump positioned between the package and one longitudinal end of the lower surface of the piezoelectric element plate, while pressing the piezoelectric element plate against the package by the adsorbing nozzle, whereby the piezoelectric element plate is joined to the package.
|
