发明名称 RESIN COMPOSITIONS, CURED ARTICLE OBTAINED THEREFROM, AND SHEET
摘要 <p>Resin compositions excellent in conformability to special shapes including curved surfaces and in holding power without the need of containing a low-molecular softener, e.g., a plasticizer, other than a polysiloxane. One of the resin compositions comprises (a) an acrylic rubber, (b) a compound having at least two mercapto groups per molecule, (c) a compound having at least two acryloyl and/or methacryloyl groups per molecule, (d) an acrylate and/or methacrylate having a C<SUB>2-12</SUB> alkyl group, and (e) acrylic acid and/or methacrylic acid. The other is the resin composition described above which contains a thermally conductive filler.</p>
申请公布号 WO2006082903(A1) 申请公布日期 2006.08.10
申请号 WO2006JP301791 申请日期 2006.02.02
申请人 DENKI KAGAKU KOGYO KABUSHIKI KAISHA;TAGUCHI, KOICHI;TAKANO, KEIJI 发明人 TAGUCHI, KOICHI;TAKANO, KEIJI
分类号 C08F220/10;C08F2/44;C08F265/06;C08G75/02;H01L23/373;H05K7/20 主分类号 C08F220/10
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