Conducting structure manufacturing method for integrated circuit arrangement, involves superimposing nucleation layer at base surface or cover surface before or after creation of through-hole, and depositing structure material in hole

摘要

The method involves creating a through-hole (403) through a substrate of an integrated circuit arrangement, where the hole passes from a cover surface to a base surface of the arrangement. An electrically conductive nucleation layer (402) is superimposed at the base surface or cover surface before or after creating the hole. An electrically conductive material of a conducting structure is galvanically deposited in the hole. An independent claim is also included for an integrated circuit arrangement comprising a conducting structure.