发明名称 JET SOLDER BATH
摘要 <p>[PROBLEMS] In the conventional jet solder baths, there have been problem of nonuniform height of molten solder jetted out from a nozzle port of a secondary jetting nozzle, a problem of an oxide applied from the nozzle port and adhered on a printed board, and a problem of erosion of a member composing the jet solder bath. [MEANS FOR SOLVING PROBLEMS] In a jet solder bath, a cylinder is placed at one end of a duct, a spiral pump is arranged on the cylinder, and a horizontal width of a nozzle port is permitted to be narrower than that of the duct.</p>
申请公布号 WO2006082960(A1) 申请公布日期 2006.08.10
申请号 WO2006JP301976 申请日期 2006.02.06
申请人 SENJU METAL INDUSTRY CO., LTD;ZEN, MITSUO;OZAWA, SATOSHI 发明人 ZEN, MITSUO;OZAWA, SATOSHI
分类号 H05K3/34;B23K1/08 主分类号 H05K3/34
代理机构 代理人
主权项
地址