| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer printed-wiring board, capable of obtaining high productivity when three or more layers of a wiring board, a copper foil or the like are to be laminated, that causes no problems, such as warpages when laminating, and obtaining large interlayer adhesion strength, and to provide the multilayer printed-wiring board manufactured by the method. SOLUTION: The multilayer printed-wiring board employs a conductive base material (L), having a conductor bump formed, an insulation substrate having a circuit on its surface, a hole formed in the insulation substrate and filled with a conductive substance, a wiring board base material (M) having a conductor bump formed, as needed, and an adhesive sheet layer (O) having a through-hole with a diameter larger than that of the bump. The total number of the conductive base material (L) and the wiring board base material (M) is three or more. The adhesive sheet layer (O) is sandwiched between the conductive base material (L) and the wiring board base material (M). They are laminate-pressed together. Thus, the manufacturing method of the multilayer printed-wiring board is realized, and the multilayer printed-wiring board manufactured by the method is also disclosed. COPYRIGHT: (C)2006,JPO&NCIPI |
