发明名称 Photosensitive resin composition, thin film panel including a layer made from photosensitive resin composition, and method for manufacturing thin film panel
摘要 A photosensitive resin composition includes an acrylic resin, a quinone diazide, and a solvent. The solvent includes a propylene glycol alkyl ether acetate and a trimethyl pentanediol monoisobutyrate (2,2,4-trimethyl-1,3-pentanediol monoisobutyrate). The propylene glycol alkyl ether acetate includes an alkyl group preferably containing about 1-5 carbon atoms. The resin composition may be used for making thin film panels for display devices.
申请公布号 US2006177767(A1) 申请公布日期 2006.08.10
申请号 US20060348924 申请日期 2006.02.06
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE DONG-KI
分类号 G03C1/76 主分类号 G03C1/76
代理机构 代理人
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