发明名称 EXPOSURE METHOD AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To suppress microscopic deviation of distribution of light quantity, in bridging exposure using a filter. <P>SOLUTION: An exposure device comprising a filter which includes a transmitting region almost uniform in the quantity of transmitting light and shielding regions so formed as to sandwich the transmitting region, an original plate for bridging exposure, a stage on which a substrate is mounted, and light quantity varying means for varying the light quantity on the substrate by a specified width, is prepared. When an optical positional relationship between the original plate and the substrate is a first condition, and a pattern formed in a first original plate region is transferred to a first substrate region. A pattern formed in a second original plate region under the first condition is transferred to a second substrate region. When the optical positional relationship between the original plate and the substrate is a second condition, a pattern formed in a third original plate region is transferred to a third substrate region overlapping with the first substrate region by the specified width. A pattern formed in a fourth original plate region under the second condition is transferred to a fourth substrate region overlapping with the second substrate region by the specified width. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006210856(A) 申请公布日期 2006.08.10
申请号 JP20050024553 申请日期 2005.01.31
申请人 TOSHIBA CORP 发明人 KIYOU SUIGEN;INOUE SOICHI
分类号 H01L21/027;G03F7/20 主分类号 H01L21/027
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