发明名称 PANEL DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a panel device 1 constituted so as to abolish the use of a lead component to reduce not only environmental load properties but also the voids in a resin coated part and capable of enhancing the protectiveness to a partner material such as a body or the like. SOLUTION: The panel device 1 comprises a panel 2 and the resin coated part 3 which coats at least a part of the panel 2. The resin coated part 3 is formed of a lead-free polyurethane resin and the D hardness thereof is set to 33-50. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006205439(A) 申请公布日期 2006.08.10
申请号 JP20050018212 申请日期 2005.01.26
申请人 AISIN SEIKI CO LTD 发明人 HARADA MIKIO;SAWADA KAZUKI
分类号 B29C39/10;B29K75/00;B29L31/30;B62D25/06 主分类号 B29C39/10
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