发明名称 FLEXIBLE PRINTED WIRING BOARD AND LIQUID INJECTION HEAD
摘要 PROBLEM TO BE SOLVED: To provide a flexible printed wiring board in which sufficient joining strength with an external wiring is acquired and the part joined to the external wiring is prevented from generating heat during energization, and a liquid injection head. SOLUTION: The flexible printed wiring board 1 comprises an insulating substrate 2 and a wiring pattern 3 which is provided at least on one surface of the insulating substrate 2 and constituted at least by one wiring 4. The liquid injection head has the flexible printed wiring board. The wiring 4 comprises a connection part 5 electrically connected to the external wiring 200 and a non-connection part 6 which is the part other than the connection part 5 and extended from the connection part 5. The end part on the connection part 5 side of the non-connection part 6 acts as a thermal diffusion reducing part 7 which reduces diffusion of the heat, given to the connection part 5 when the connection part 5 is heat-joined to the external wiring 200, to the non-connection part 6 side. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006210855(A) 申请公布日期 2006.08.10
申请号 JP20050024505 申请日期 2005.01.31
申请人 SEIKO EPSON CORP 发明人 KITAMURA KENICHI;MIYATA YOSHINAO
分类号 H05K1/11;B41J2/01;B41J2/045;B41J2/055;H05K1/02 主分类号 H05K1/11
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