| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component accommodation package where width of cut-away in which an electric check terminal is formed becomes narrower, generation of electric contact failure can be prevented on the occasion of placing in contact a probe pin, through repetitive pushing thereof, to the electric check terminal formed at the internal wall surface of the cut-away at the side surface of a base material, and dividing property of the base material can be improved. SOLUTION: The electronic component accommodation package comprises the base material 101 including a mounting part 102 of an electronic component 107 at the upper surface thereof, the cut-away 103 formed in both upper and lower directions at the side surface of the base material 101, and a conductive layer 104 formed at the internal surface of the cut-away 103 and electrically connected to the electronic component 107. The front surface of the end in the upper surface side of a conductive layer 104 and the front surface of the end in the lower surface side are entering the internal side of the cut-away 103 more than the surface of the central area. COPYRIGHT: (C)2006,JPO&NCIPI
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