| 摘要 |
PROBLEM TO BE SOLVED: To provide ultrathin copper foil with a carrier which permits easy peeling of carrier foil and ultrathin copper foil by having a release layer capable of withstanding a working temperature under a high temperature in using a base material being a high-heat resistant resin and is provided with decreased pinholes by applying uniform plating to the foil without impairing the peelability of the release layer, to provide a method for manufacturing the same, and to provide a printed wiring board using the ultrathin copper foil with the carrier. SOLUTION: The ultrathin copper foil with the carrier consists of the carrier foil, the release layer and the ultrathin copper foil and is formed by disposing a strike plating layer consisting of copper containing P on the surface of the release layer side between the release layer and the ultrathin copper foil, disposing the ultrathin layer of copper at need thereon and further disposing the ultrathin copper foil consisting of Cu or a copper alloy, or Cu containing P or a P-containing Cu alloy thereon, and to provide a method for manufacturing the same. COPYRIGHT: (C)2006,JPO&NCIPI
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