| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting tool which is light-weight and transmits ultrasonic waves well. <P>SOLUTION: The mounting tool 1 is for mounting a semiconductor on a substrate by flip-chip bonding method. The mounting tool 1 consists of a ceramic sintered body which is an integrated end 10 and horn 3. The ceramic sintered body is formed of silicon carbide, silicon nitride, or alumina. The end 10 has a suction surface 2 for sucking the semiconductor and a suction hole 4 which is formed in the suction surface 2 to suck the semiconductor. The horn 3 has an installation portion with respect to an ultrasonic vibrator, and a through hole 5 communicating with the suction hole 4 of the end 10. The suction surface 2 is coated with gas phase synthetic diamond. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
