| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device whose thickness of the whole package is reduced. SOLUTION: The semiconductor device 1 includes a substrate 2 having wiring, a surface 4a forming an element on the substrate 2, a first semiconductor chip 4 mounted so that 6a is on the substrate side, and a second semiconductor chip 6 mounted on the first semiconductor chip 4. In the first semiconductor chip 4, the wiring layer which is electrically connected with the wiring of the substrate is located on the back opposed to the second semiconductor chip 6. COPYRIGHT: (C)2006,JPO&NCIPI
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