| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for efficiently manufacturing a highly reliable wiring board, having a resistance body. SOLUTION: In the manufacturing method of a wiring board including a resistance body 12 which is arranged with both ends covered with a couple of separately provided electrodes 14a, 14b of a wiring pattern 13, a part for forming a resistance body of a first metal layer 20 formed by the non-electrolytic plating is removed, and a metal layer 12 for resistance is formed as the resistance body there with the non-electrolytic plating. A second resist layer pattern is formed, covering the part other than the part to form the wiring pattern including a couple of electrodes, and electrolytic plating is conducted, using such a resist layer as the mask for the plating, in view of forming the second metal layer 23 pattern which is the same as the wiring pattern. Thereafter, the wiring pattern 13 is formed, by removing the exposed first metal layer 20 other than the part to form the wiring pattern, by uniformly conducting the etching process to the entire part of the surface of the substrate. COPYRIGHT: (C)2006,JPO&NCIPI
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