MICROELECTRONIC BUNDLE MODULE OR DEVICE

摘要

The invention relate to radioelectronic engineering and can be used for producing high-accurate, ultra-accurate, ultrastable and high-quality oscillating loops, circuits and devices in radio and electronic sectors requiring a high and ultra-high accuracy and quality of electronic components and circuits. The inventive microelectronic bundle module or device comprises the following multilayer electronic bundle components: microelectronic boards, substrates, conductor tracks, resistors, inductive coils, capacitors, diodes, tyristors, transistors which form different microcircuits for modules or devices and made from thin single-type elements consisting of N>1 layers of thin films or fibre elements, wherein said films and fibres are combined into a pile or beam whose thickness d< 80 mkm, the physical characteristics of the components are proportionally enhanced and the dispersion thereof is decreased when the number of layers in the pile or the number of fibres in the bundle having said thickness is increased. In comparison with single-element modules or devices, the invention makes it possible to increase by one order and more of magnitude the result consisting in improving a resolution capability, input resistance, quality, accuracy and ultra-accuracy, reliability, service life, environmental stability, current overloading and a power.