| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an SAW device capable of realizing low height and a communication module, and to realize a manufacturing method of the SAW device capable of low height. <P>SOLUTION: A wall (or bank) 10 of a height of about 20 μm which is made of a resin such as polyimide is provided on the surface (active surface) of a piezoelectric substrate 3 so as to surround a vibration portion 4 of a surface acoustic wave including an IDT electrode 4a and a reflector electrode 4b. The wall 10 of a height of about 20 μm which is made of a resin such as polyimide blocks a sealing resin 11 for sealing a space formed between an SAW piezoelectric element 2 and a wiring substrate 9 and including the vibration portion 4 of the surface acoustic wave so that the space may not exceed the height H of top of the SAW piezoelectric element 2. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
