| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which can form a dry film, fully exhibiting superior storage stability, and can also form a solder resist fully exhibiting high solvent resistance. <P>SOLUTION: The photosensitive resin composition contains (A) a resin, having a repeating unit represented by Formula (1) [where R<SP>1</SP>denotes a divalent organic group which is a diglycidyl ether type epoxy compound residue; R<SP>2</SP>denotes a divalent organic group which is a dibasic acid residue; and R<SP>3</SP>denotes H or a group represented by Formula (2) (where R<SP>4</SP>denotes an acid anhydride residue)], (B) a photopolymerizable compound having an ethylenically unsaturated group within a molecule, (C) a photopolymerization initiator and (D) a blocked isocyanate compound. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
