| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a printed wiring board which has heat resistance sufficient to be adaptive to lead-free solder etc. , can be developed with a sodium carbonate solution etc. , and uses photo-solder resist that does not produce sludges in the developing tank. <P>SOLUTION: On a substrate which has a conductor pattern formed on one surface or both surfaces, a photo-solder resist layer is formed which contains, as principal component, alkali-soluble resin with a bisphenol fluorene skeleton, obtained by making a reactant of an epoxy compound, having a glycidyl ether group as a resin component and (meth)acrylic acid react, saturated dicarboxylic acid or its acid anhydride (a), and unsaturated tetracarboxylic acid or its acid dianhydride (b) react with each other within the range of 0.1 to 10 mol ratio a/b. Then development is carried out with a solution of 1 to 4 wt% sodium bicarbonate to form a pattern, and thus the printed wiring board is manufactured with a resist layer patterned by heat curing. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
