| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component mounting board having higher mounting reliability and thermal shock reliability and an electronic device using the same board for improving thermal shock reliability of the electronic device mounting board itself, and controlling conductivity failure and connecting failure of the connecting portion between electronic component and external circuit board. <P>SOLUTION: In the electronic component mounting board 1; a through-hole is formed in the thickness direction of an insulating base material 2 on which an electronic component 7 is mounted, a lead terminal 11 connected to the electronic component 7 at one principal surface side of the insulating base material 2 is inserted into this through-hole, and this lead terminal 11 is fixed with a sealing glass 3 within the through-hole. The lead terminal 11 includes a narrow part 6 at the fixing portion thereof. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
