发明名称 PROCESS FOR MANUFACTURING MULTILAYER ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a process for manufacturing a multilayer electronic component in which sheet attack can be prevented while eliminating a level difference caused by the conductive layer of an internal electrode, or the like. SOLUTION: The multilayer electronic component such as a multilayer ceramic capacitor 1 is manufactured by laying a plurality of unit sheets 35 in layers wherein the unit sheet 35 is produced by forming internal electrode layers 5, 7 and level difference absorption layers 6, 8 on a green sheet 25 formed of ceramic paste 23 on a PET film 21. At first, a first unit sheet having an upper level difference absorption layer 6 formed on the upper surface of at least one internal electrode layer is prepared, and a second unit layer having a portion not forming a conductive layer on the side of the conductive layer is prepared and then the second unit layer is laid in layer on the first unit layer such that the portion not forming a conductive layer is located above the level difference absorption layer. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006210813(A) 申请公布日期 2006.08.10
申请号 JP20050023656 申请日期 2005.01.31
申请人 TDK CORP 发明人 ANDO NORIHISA;ITO TAKAYOSHI
分类号 H01G4/12;H01G4/30 主分类号 H01G4/12
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