| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing a semiconductor and a heat treatment apparatus capable of shortening treatment time, by improving the efficiency of temperature rise and temperature fall while miniaturizing the apparatuses. SOLUTION: The apparatus for manufacturing the semiconductor comprises a process tube 10 having conductive properties and storing a semiconductor; a cylindrical heat insulation/cooling structure 20 for forming a space 23 for covering an outer circumference of the process tube 10 for heat insulation and cooling of the tube 10; an induction heating coil 30 disposed on an outer circumference of the heat insulation/cooling structure 20; an induction heating control circuit 40 for driving the induction heating coil 30; and a fluid introduction passage 71 to the space 23 of the heat insulation/cooling structure 20, and fluid discharge passages 72, 73 from the space 23. The space 23 is switchable to a vacuum state and to a passage state of a cooling medium. COPYRIGHT: (C)2006,JPO&NCIPI
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