| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition showing a good close adhesion to a Ni-Pd lead frame and also having a low elasticity, and a semiconductor device excellent in reliability such as solder crack resistance, etc., obtained by using the resin composition as a die attach material for the semiconductor. SOLUTION: This resin composition used for bonding the semiconductor element is provided by containing (A) silver powder, (B) compounds having a glycidyl group, (C) an imidazole compound having≥180°C melting point as essential components. The part of the compounds (B) is a compound having a polyalkylene oxide skeleton and glycidyloxyphenyl group. COPYRIGHT: (C)2006,JPO&NCIPI
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