| 摘要 |
A semiconductor chip includes a plurality of pads; a plurality of interface circuits connected with the plurality of pads, respectively; an internal circuit connected with the plurality of interface circuits; and a transfer circuit connecting the plurality of interface circuits with each other in response to a test mode signal. One of the plurality of pads is a selected pad when the pad is probed, at least one remaining pad is a non-selected pad, one of the plurality of interface circuits corresponding to the selected pad is a selected interface circuit, and at least one remaining interface circuit is a non-selected interface circuit. The internal circuit is tested by using the selected pad, the selected interface circuit, the transfer circuit, and the non-selected interface circuit without using the non-selected pads.
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