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经营范围
发明名称
Epoxy Resin Composition for Encapsulating Semiconductor Device
摘要
申请公布号
KR100611459(B1)
申请公布日期
2006.08.09
申请号
KR20030100376
申请日期
2003.12.30
申请人
发明人
分类号
C08L63/04
主分类号
C08L63/04
代理机构
代理人
主权项
地址
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