| 摘要 |
PURPOSE: A wire bonding method for a semiconductor device is provided to simply control bonding balls corresponding to different chip pad sizes of a plurality of semiconductor chips stacked on a circuit board, by controlling a current value applied to an electrical discharge bar or discharge time. CONSTITUTION: The bonding ball(11) is formed at the end of a wire(1) by using the electrical discharge bar. The bonding ball is firstly bonded to a pad of the semiconductor chip mounted on the circuit board(10), and is secondly bonded to a circuit pattern(12) of the circuit board while making a wire loop. The first and second bonding processes are repeated between a plurality of bonding pads of the semiconductor chip and a plurality of circuit patterns of the circuit board. The size of the bonding ball is controlled by varying either one of the current value discharged to the electrical discharge bar or the discharge time. |
