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发明名称
SAWING APPARATUS FOR MANUFACTURING SEMICONDUCTOR CHIP PACKAGE
摘要
申请公布号
KR20060089798(A)
申请公布日期
2006.08.09
申请号
KR20050010557
申请日期
2005.02.04
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
KANG, CHANG JIN;JU, YOUNG JIN;LEE, DO WOO;UM, TEA SEOG;JUNG, CHANG YONG;SEO, HO WON
分类号
H01L21/78
主分类号
H01L21/78
代理机构
代理人
主权项
地址
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