| 摘要 |
An organic electronic device using an extremely thin substrate is manufactured by a simple and easy method. That is, according to the method of manufacturing the organic electronic device of the present invention, a first surface of a substrate is subjected to polishing, a protective layer is provided on the first surface, and a second surface on the back side of the first surface of the substrate is removed through etching to reduce the thickness of the substrate. As a result, the extremely thin substrate may be formed. Two extremely thin substrates manufactured through the above process are arranged such that etching surfaces thereof are opposed to each other. Then, the two substrates are bonded to each other so as to hold a layer containing a polymer material therebetween. Thereafter, the protective layer is removed. Accordingly, the organic electronic device is formed on the first surface from which the protective layer has been removed. |
