首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
METHOD FOR FORMING METAL INTERCONNECTION OF SEMICONDUCTOR DEVICE
摘要
申请公布号
KR100609049(B1)
申请公布日期
2006.08.09
申请号
KR20040101930
申请日期
2004.12.06
申请人
发明人
分类号
H01L21/28;H01L21/283
主分类号
H01L21/28
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Powder coating process for forming soft flexible polyurethane film
Method of manufacturing a row of continuous coupling elements for slide fasteners
Electrophotographic copying machine
Exposure meter
Foldable and portable vehicle
Hot water heating system
Process for producing cold and/or heat by use of an absorption cycle with carbon dioxide as working fluid
Extrudable self-supporting hot melt adhesive sheet
Preparation of linear olefin products
Luminaire birdshield
Differential light emission translucent light bowl and cap
Air filtration device
System for controlling the starting operation of an internal combustion engine
Vacuum power interrupting device
Pinned ceramic substrate
Process for isomerizing olefins
Polymerizing olefins with a novel catalyst
Heat curable polydiorganosiloxane compositions having enhanced release upon cure
Titanium trichloride catalytic component and homo- or co-polymerization of alpha -olefin
1,3-Dibromo dialkylhydantoin and olefin oligomer reaction product as a catalyst for preparing alkenyl dicarboxylic acid anhydride