| 摘要 |
A shielding apparatus for a portion of a printed circuit board is provided comprising a cover for shielding a selected portion of the printed circuit board. The cover includes an edge, wherein a sidewall is molded about the edge of the cover. The sidewall includes a first and second ledge for supporting the edge of the cover. The shielding apparatus is further shown to include an inner wall extending from a first portion of the sidewall to a second portion of the sidewall for defining discrete areas of the printed circuit board being shielded. In this arrangement, the cover may define apertures in the cover along the abutment with the inner wall to improve flow during the insert molding process and provide a mechanical bond between the cover and the inner wall.
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