Photoreactive resin composition, method for making circuit substrate using same, and method for making ceramic multilayer substrate using same

摘要

A photoreactive resin composition contains (a) a powdered base metal, (b) an organic binder, (c) a photosensitive organic component, and (d) a polycarboxylic acid-based dispersing agent with a molecular weight of about 1,500 or less. Also disclosed is a method for making a circuit substrate or a ceramic multilayer substrate including the step of forming a conductive pattern using the photoreactive resin composition.