发明名称 |
Resin film and multilayer printed wiring board using thereof |
摘要 |
A resin film comprising (A) an epoxy resin having two or more glycidyl groups in a molecule, (B) an epoxy resin curing agent, (C) a thermoplastic resin, and (D) a filler, wherein the filler content in at least either one of the surface regions on the cross-section of the film is less than the filler concentration in the central region. The resin film has not only toughness but also fire retardancy, high interlayer adhesion strength and good processability of metal plating.
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申请公布号 |
US7087664(B2) |
申请公布日期 |
2006.08.08 |
申请号 |
US20040762302 |
申请日期 |
2004.01.23 |
申请人 |
SUMITOMO CHEMICAL COMPANY, LIMITED |
发明人 |
HAYASHI TOSHIAKI;FURUTA KATSUHIRO |
分类号 |
C08J5/18;C08K3/36;C08L63/00;C08L81/06;H05K1/03;H05K3/46 |
主分类号 |
C08J5/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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