发明名称 |
Die bonding method and apparatus |
摘要 |
A die bonding method and apparatus that performs bonding position detection and bonding inspection without lowering the productivity, in which after a bonding head has bonded a semiconductor chip to an island, the bonding head is moved to a wafer to pick up a semiconductor chip and is returned to the island; and during this period, an island used for bonding inspection (that is the island on which bonding has just been performed) and an island used for position detection (that is the island on which bonding is to be done next) are imaged by a camera in the same visual field, and inspection of the bonding conditions of the island used for inspection and detection of the position of the island used for position detection are performed based on the acquired image data.
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申请公布号 |
US7087457(B2) |
申请公布日期 |
2006.08.08 |
申请号 |
US20040772936 |
申请日期 |
2004.02.05 |
申请人 |
KABUSHIKI KAISHA SHINKAWA |
发明人 |
OGATA YOSHIYUKI;ARAI HISASHI |
分类号 |
H01L21/52;H01L21/58;H01L21/00;H05K13/04 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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