发明名称 |
Device, design and method for a slot in a conductive area |
摘要 |
A design, device, system and process for placing slots in active regions (e.g., metal areas). Embodiments of the present invention improve the planarization of metal areas (e.g., lines) and insulators by reducing depressions (e.g., dishing) in the metal areas by including symmetric or square slots inside selected wide metal lines, by adhering to a set of placement rules. Embodiments reduce dishing in copper dual damascene structures. Embodiments reduce data processing requirements for designing and arranging the layout of IC devices and the slots.
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申请公布号 |
US7089522(B2) |
申请公布日期 |
2006.08.08 |
申请号 |
US20030458992 |
申请日期 |
2003.06.11 |
申请人 |
CHARTERED SEMICONDUCTOR MANUFACTURING, LTD. |
发明人 |
TAN PATRICK;TEE KHENG CHOK;VIGAR DAVID;CHUA TAT WEI |
分类号 |
G06F17/50;H01L21/768;H01L23/528 |
主分类号 |
G06F17/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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