发明名称 |
Substrate having built-in semiconductor apparatus and manufacturing method thereof |
摘要 |
A substrate having a built-in semiconductor apparatus includes: a semiconductor apparatus which comprises a first semiconductor chip having a first electrode pad formed on a main surface thereof, a protruding portion which is in contact with the first semiconductor chip and protrudes from a side surface of the first semiconductor chip to the outside, an apparatus wiring portion which is provided so as to extend from the first electrode pad onto a surface of the protruding portion, a conductive portion which is in connected with the apparatus wiring portion and provided on the apparatus wiring portion, and a sealing layer which covers the main surface and the surface of the protruding portion so as to expose a top face of the conductive portion; an insulating layer in which the semiconductor apparatus is embedded; an external terminal provided on the insulating layer; and a substrate wiring portion which electrically connects the conductive portion with the external terminal.
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申请公布号 |
US7087514(B2) |
申请公布日期 |
2006.08.08 |
申请号 |
US20050218534 |
申请日期 |
2005.09.06 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
SHIZUNO YOSHINORI |
分类号 |
H01L21/44;H01L23/12;H01L21/60;H01L23/498;H01L23/52;H01L23/538;H01L25/04;H01L25/10;H01L25/18 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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