发明名称 |
Chip packaging compositions, packages and systems made therewith, and methods of making same |
摘要 |
A system for chip packaging includes an adamantoid packaging composition. The adamantoid composition ameliorates the CTE mismatch that typically exists between a packaged die and a resin-impregnated fiberglass mounting substrate. In an embodiment, the system includes a packaging composition that alone exhibits a CTE that is characteristic of an inorganic-filled underfill composite previously known. An embodiment is also directed to the assembly of a chip package that uses an adamantoid packaging composition.
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申请公布号 |
US7088010(B2) |
申请公布日期 |
2006.08.08 |
申请号 |
US20030740283 |
申请日期 |
2003.12.18 |
申请人 |
INTEL CORPORATION |
发明人 |
LIM SHEAU HOOI;CHEE CHOONG KOOI |
分类号 |
H01L23/14;H01L21/48;H01L21/56;H01L21/60;H01L23/29;H01L23/538 |
主分类号 |
H01L23/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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