发明名称 Spray cooling system
摘要 A spray cooling system for efficiently thermally managing a single or multiple semiconductor chip package. The spray cooling system includes a heat exchanger unit having a pump unit and a reservoir, a coaxial tube fluidly connected to the heat exchanger unit, a coupler unit attached to the coaxial tube, and a spray module where the coupler unit is removably connected to the spray module. The heat exchanger unit has an air tolerant design that allows for the entry and release of air without interfering with the operation thereof.
申请公布号 US7086455(B1) 申请公布日期 2006.08.08
申请号 US20040955323 申请日期 2004.09.30
申请人 ISOTHERMAL SYSTEMS RESEARCH, INC. 发明人 TILTON CHARLES L.;TILTON DONALD E.;BADDELEY RYAN J.;CADER TAHIR;WOS GEORGE J.
分类号 F28D15/02;F25D23/12;F28F7/02;H01L23/433 主分类号 F28D15/02
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