发明名称 |
Modularized probe card for high frequency probing |
摘要 |
A modularized probe head for high frequency probing is provided. The probe head mainly includes a probe head, a mounting board and an interposer between the probe head and the mounting board. The probe head has a plurality of cavities on its back surface. A plurality of decoupling components are installed inside the cavities and are electrically coupled to the ground/power circuitry of the probe head via by-pass circuitry. The interposer has a bottom surface corresponding to the back surface of the probe head, and includes a plurality of contact ends on the bottom surface. Some of the contact ends electrically contact the decoupling components and electrically coupled to the ground plane of the mounting board.
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申请公布号 |
US7088118(B2) |
申请公布日期 |
2006.08.08 |
申请号 |
US20040011200 |
申请日期 |
2004.12.15 |
申请人 |
CHIPMOS TECHNOLOGIES INC. |
发明人 |
LIU AN-HONG;WANG YEONG-HER;CHAO YEONG-CHING;LEE YAO-JUNG |
分类号 |
G01R31/02 |
主分类号 |
G01R31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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