发明名称 SPUTTERING TARGET MATERIAL
摘要 A sputtering target material by which generation of arcing phenomenon and splash phenomenon during sputtering are eliminated to the minimum. A friction stir process is performed to a part of the sputtering target material to be used for sputtering. The arcing phenomenon and the splash phenomenon during sputtering are surely suppressed, even the sputtering target material is composed of an aluminum alloy containing carbon or big.
申请公布号 KR20060088903(A) 申请公布日期 2006.08.07
申请号 KR20067010161 申请日期 2006.05.24
申请人 MITSUI MINING & SMELTING CO., LTD.;NIPPON LIGHT METAL COMPANY, LIMITED 发明人 KATO KAZUTERU;KUBOTA TAKASHI;KIMURA HIROSHI;MATSUURA YOSHINORI;MATSUZAKI KENJI
分类号 B23K20/12;C22C1/02;C22C1/04;C22C21/00 主分类号 B23K20/12
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