发明名称 Uv curable composition
摘要 The present invention relates to a composition for forming layers on substrates which are removable upon scratching after being curing by UV radiation. The composition comprises film forming components with at least one first organic molecule having at least one epoxy group and at least one second organic molecule having at least one nucleophilic group being crosslinkable with said epoxy group of said first organic molecule upon irradiation with electromagnetic radiation in the ultraviolet range of the electromagnetic spectrum, wherein the weight ratio (r) of the sum of the film forming components and said substances insoluble in the composition is in the range of between 0.35 to 0.85, preferably between 0.4 and 0.7, even more preferably between 0.45 and 0.6. <IMAGE>
申请公布号 HK1055989(A1) 申请公布日期 2006.08.04
申请号 HK20030108167 申请日期 2003.11.11
申请人 SICPA HOLDING S.A. 发明人 ALINE VUARNOZ;PATRICK VEYA
分类号 B05D5/00;B05D7/24;C09D5/00;C09D5/20;C09D11/101;C09D163/00;(IPC1-7):C09D 主分类号 B05D5/00
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