发明名称 |
MICROELECTRONIC CLEANING COMPOSITIONS AND METHODS OF FABRICATING SEMICONDUCTOR DEVICES USING THE SAME |
摘要 |
According to an example embodiment of the present invention, the microelectronic cleaning agent may include a fluoride component, an acid component, a chelating agent, a surfactant and water. Example embodiments of the present invention provide a microelectronic cleaning agent which can selectively remove, for example, a high-k dielectric layer. The microelectronic cleaning agent includes from about 0.001 weight % to about 10 weight % of a fluoride component, from about 0.001 weight % to about 30 weight % of an acid component, from about 0.001 weight % to about 20 weight % of a chelating agent, from about 0.001 weight % to about 10 weight % of a surfactant, and water (H<SUB>2</SUB>O). The water may comprise the remainder of the cleaning agent. According to another embodiment of the present invention, a method of fabricating a semiconductor device using the microelectronic cleaning agent is also provided. |
申请公布号 |
KR20060088380(A) |
申请公布日期 |
2006.08.04 |
申请号 |
KR20050009254 |
申请日期 |
2005.02.01 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, SANG YONG;CHA, JI HOON;HONG, CHANG KI;CHOI, SANG JUN;SHIM, WOO GWAN;BAEK, KUI JONG;KIM, SUNG BAE;KIM, HYUN TAK;LEE, SANG WON;HAN, WOONG;LIM, JUNG HUN |
分类号 |
C11D3/02 |
主分类号 |
C11D3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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