| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an acid electrolytic copper plating bath, first, having excellent uniform electrodeposition properties, and, next, exhibiting high via filling capacity. <P>SOLUTION: In the electrolytic copper plating bath comprising a soluble copper salt and base acid, the base acid is at least one oxycarboxylic acid selected from the group consisting of glycolic acid, lactic acid, citric acid, malic acid, gluconic acid and glucoheptonic acid or their salts. Further, the mixed acid of the same specified oxycarboxylic acid and organic sulfonic acid or specified organic sulfonic acid such as isethionic acid may be used as the base acid. Since the specified organic acid is used as the base acid in the copper plating bath, its uniform electrodeposition properties to the surface of a base are excellent compared with the conventional copper sulfate bath or the like. Further, the copper plating bath can be satisfactorily applied to a substrate in which via holes and through-holes are coexistent because of its high via filling capacity. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
